|When:||Friday, January 11, 2013|
2:00 PM - 3:00 PM
Ford Motor Company Engineering Design Center, ITW Auditorium (1.350) |
2133 Sheridan Road
Evanston, IL 60208 map it
|Audience:||- Faculty/Staff - Student - Public|
(847) 467-0028 |
|Group:||Electrical Engineering & Computer Science|
|Category:||Lectures & Meetings|
The EECS Department welcomes Prof. Yuan Xie of Pennsylvania State University.
Prof. Xie will present a lecture on Friday January 11 entitled "Three-dimensional Integrated Circuits (3D ICs): Design, EDA, and Architecture"
Abstract: 3D Integration emerges as an attractive option to sustain Moore's law and enable More-than-Moore. This talk will first present an overview of my research work in 3D IC designs, including both design tools perspective and architecture design perspective. It will also emphasize the following research directions for future 3D IC design: Design automation and test techniques and methodologies for 3D designs are imperative to realize 3D integration; Novel architectures and design space exploration at the architectural level are also essential to leverage 3D integration technologies for performance gain; and possible "killer" application for 3D integration (e.g., what application could dramatically benefit from 3D stacking technology or what novel applications are enabled by 3D technology.)
Please click the "More Info" link above to read the full abstract and Prof. Xie's bio.