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DTSTART;TZID=America/Chicago:20260423T123000
DTEND;TZID=America/Chicago:20260423T133000
DTSTAMP:20260411T190721Z
SUMMARY:3M Seminar with Fay Salmon\, Ph.D.
UID:641608@northwestern.edu
TZID:America/Chicago
DESCRIPTION:Corporate Engagement is pleased to announce a new seminar series sponsored by our partners at 3M\, launching this spring at Northwestern University. Co-hosted by the McCormick Dean’s Office and Corporate Engagement\, the series is open to all NU faculty\, staff\, and students.  The first seminar will take place on Thursday\, April 23\, from 12:30–1:30 p.m. in Cohen Commons and will feature speaker Fay Salmon\, Senior Staff Scientist.  Please register by April 13 to reserve your boxed lunch for the seminar and to receive a calendar invitation.  Abstract: This talk presents an overview of 3M’s use of simulation to accelerate product development and better serve customer needs. I will highlight how deep fundamental and mechanistic understanding of product performance enables faster development of differentiated solutions. Examples from adhesives (soft matters)\, abrasives\, and chemical–mechanical planarization will illustrate how advanced research with a clear value proposition sustains competitive advantage. I will also provide a high-level overview of ongoing work in computational materials\, lab automation\, AI-assisted materials design\, and materials for energy and data centers\, and challenges we face.\n\nRegister: https://forms.office.com/Pages/ResponsePage.aspx?id=YdN2fXeCCEekd2ToNmzRvOTQRj0g11ROnBlVME_WVjRUMjhSTkZPTFdTSklLSUVWTjBTMURNV0k2Vy4u
LOCATION:Technological Institute\, Cohen Commons (Room L482)\, 2145 Sheridan Road\, Evanston\, IL 60208
TRANSP:OPAQUE
URL:https://planitpurple.northwestern.edu/event/641608
CREATED:20260409T050000Z
STATUS:CONFIRMED
LAST-MODIFIED:20260409T050000Z
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